Hermetically-sealed packages including feedthrough assemblies

A feedthrough assembly comprising:

• a non-conductive substrate;
• a feedthrough comprising:
• a via from an outer surface to an inner surface of the non-conductive substrate;
• a conductive material disposed in the via;
• and
• an external contact disposed over the via on the outer surface of the non-conductive substrate, wherein the external contact is electrically coupled to the conductive material disposed in the via, and wherein the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via;
• and
• a weld ring attached to the non-conductive substrate.

A hermetically-sealed package comprising:

• a housing;
• a feedthrough assembly that forms a part of the housing, wherein the feedthrough assembly comprises a non-conductive substrate and a feedthrough, wherein the feedthrough comprises:
• a via from an outer surface to an inner surface of the non-conductive substrate;
• a conductive material disposed in the via;
• and
• an external contact disposed over the via on the outer surface of the non-conductive substrate, wherein the external contact is electrically coupled to the conductive material disposed in the via, and wherein the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via;
• and
• a weld ring attached to the non-conductive substrate of the feedthrough assembly and the housing.