Laser processing method, joint method, copper member, method of manufacturing multi-layer printed circuit board, and multi-layer printed circuit board
AssigneeFurukawa Electric Co., Ltd.
InventorsMasaki Iwami, Shunichi Matsushita
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a laser processing method of performing surface processing on a copper surface by using laser. The method forms a periodic structure on the order of laser wavelength on a copper surface by irradiating the copper surface with pulse laser having a laser power close to a threshold beyond which processing of copper foil is possible and having a pulse width on the order of nanoseconds, and forms a coating on the copper surface. in this manner, the copper surface can be processed to have a favorable electric characteristic and desirable adhesion with a resin material.
Claims17
A laser processing method of performing surface processing on a copper surface by using laser comprising:
- forming a periodic structure on an order of laser wavelength on the copper surface by irradiating the copper surface with pulse laser having a laser power close to a threshold beyond which copper processing is possible and having a pulse width on an order of nanoseconds.
A joint method of joining copper foil to a resin material comprising:
- forming a roughed part having a periodic structure on an order of laser wavelength on a surface of the copper foil by irradiating the surface of the copper foil with pulse laser having a laser power close to a threshold beyond which copper processing is possible and having a pulse width on an order of nanoseconds;
- and
- performing laser welding or heat press bonding of the roughed part formed on the surface of the copper foil to the resin material.
A copper member, wherein on at least one surface of the copper member, a periodic structure having a period of 0.35 μm to 2 μm in a planar direction and a height of less than 1.5 μm being formed, a coating is formed on the periodic structure, and an irregular structure having a period shorter than a period of the periodic structure is formed on a surface of the coating.
A printed circuit board manufacturing method of manufacturing a multi-layer printed circuit board comprising:
- forming a periodic structure on an order of laser wavelength at an inner-layer wiring part of the multi-layer printed circuit board by selectively irradiating the inner-layer wiring part with pulse laser having a laser power close to a threshold beyond which copper processing is possible and having a pulse width on an order of nanoseconds.
A multi-layer printed circuit board on which an inner-layer wiring part is formed, wherein a periodic structure having a period of 0.35 μm to 2 μm in a planar direction and a height of less than 1.5 μm is formed in parallel to a current conduction direction at the inner-layer wiring part.
Dependencies are inferred from the claim text.