Substrate processing system printed-circuit control board assembly with one or more heater layers

In a substrate processing system comprising a substrate processing chamber and an electrostatic chuck (ESC) inside the substrate processing chamber to hold substrates,

• a printed circuit board assembly (PCBA) comprising a plurality of printed circuit board layers, wherein one or more of the plurality of printed circuit board layers are configured to mount one or more integrated circuits (ICs) that control operation of the ESC,
• the plurality of printed circuit board layers comprising:
• a first printed circuit board layer containing a first metal trace to cover a first region of the first printed circuit board layer;
• and
• a second printed circuit board layer containing a second metal trace to cover a second region of the second printed circuit board layer,
• wherein the first and second metal traces are arranged such that current flows through the first metal trace in a first direction and current flows through the second metal trace in a second direction that is opposite the first direction,
• the first metal trace and the second metal trace being used to provide heat to one or more others of the plurality of printed circuit board layers to maintain the one or more ICs within a predetermined temperature range.