Molded interconnect device and method of making same

A method of forming a molded interconnect device (MID), the method comprising the steps of:

• a) injection molding a palladium-catalyzed material into a palladium-catalyzed substrate of a desired shape;
• b) forming a thin copper film over exterior and exposed surfaces of the palladium-catalyzed substrate;
• c) ablating or removing some of the copper film from the palladium-catalyzed substrate to provide first and second portions of the copper film and one or more ablated sections;
• d) electrolytically plating the first portion of the copper film with a first plating and to form an assembly;
• e) non-selectively adding solder resist onto the assembly;
• f) ablating or removing the solder resist from one or more parts of the first portion;
• g) electrolytically plating the one or more parts of the first portion to form a metallic-plated first portion;
• and
• h) ablating or removing the solder resist on the second portion, the second portion, and the solder resist from the one or more ablated sections in order to isolate the metallic-plated first portion, where the metallic-plated first portion comprises a circuit portion of the MID.

A method of forming a molded interconnect device (MID), the method comprising the steps of:

• a) injection molding a palladium-catalyzed material into a palladium-catalyzed substrate of a desired shape;
• b) forming a thin copper film over exterior and exposed surfaces of the palladium-catalyzed substrate;
• c) ablating or removing some of the copper film from the palladium-catalyzed substrate to provide first and second portions of the copper film and one or more ablated sections;
• d) electrolytically plating the first portion of the copper film with a plating and to form an assembly;
• e) non-selectively adding solder resist onto the assembly;
• f) ablating or removing the solder resist on the second portion, the second portion, the solder resist from one or more sections of the first portion, and the solder resist from the one or more ablated sections in order to isolate the metallic-plated first portion, where the metallic-plated first portion comprises a circuit portion of the MID.

A molded interconnect device (MID) comprising:

• a palladium-catalyzed substrate;
• a circuit portion;
• and
• a Faraday cage portion, the Faraday cage portion being isolated from the circuit portion.