Ceramic electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsIssei YAMAMOTO, Yosuke MATSUSHITA
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Abstract
A ceramic electronic component according to the present disclosure includes a wiring formation layer including a ceramic insulation layer containing a low-temperature co-fired ceramic material and a wiring pattern formed on the ceramic insulation layer. The wiring formation layer further has a plurality of dummy patterns formed on a portion of the ceramic insulation layer where the wiring pattern is not formed. The wiring width of the dummy patterns is less than the minimum value of the wiring width of the wiring pattern.
Claims18
A ceramic electronic component comprising at least one wiring formation layer including a ceramic insulation layer containing a low-temperature co-fired ceramic material and a wiring pattern provided on the ceramic insulation layer,
- wherein the at least one wiring formation layer further has a plurality of dummy patterns provided on a portion of the ceramic insulation layer where the wiring pattern is not provided, and
- a wiring width of the dummy patterns is less than a minimum value of a wiring width of the wiring pattern.
Dependencies are inferred from the claim text.