High-speed hybrid circuit
AssigneeFinisar Corporation
InventorsSteven C. Bird, Henry Meyer Daghighian
Life of this patent
Estimating the term…
Abstract
A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
Claims20
A circuit, comprising:
- a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board;
- a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board;
- and
- at least one electronic circuit die including at least one die bond pad, the at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
An optoelectronic module, comprising:
- an optical transmitter;
- an optical receiver;
- a circuit including:
- a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board;
- a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board;
- and
- at least one electronic circuit die including at least one die bond pad, the at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
A method, comprising:
- forming a cavity from a first outer surface of a multilayer rigid flex circuit board at least partially through the multilayer rigid flex circuit board;
- forming a window from a first outer surface of a cap layer to the cavity, the cap layer attached at a second outer surface of the cap layer to a second outer surface of the multilayer rigid flex circuit board;
- and
- mounting a heat sink in the cavity with a first outer surface of the heat sink configured for mounting at least one electronic circuit die thereon.
Dependencies are inferred from the claim text.