Printed circuit board and electronic component package including same

An electronic component package comprising:

• a chassis case;
• a printed circuit board disposed inside the chassis case;
• and
• at least one active component disposed on the printed circuit board and including a plurality of grounds,
• wherein the printed circuit board includes a data line layer,
• a ground layer disposed above the data line layer and including a common ground and a chassis ground electrically insulated from the common ground,
• a power line layer disposed above the ground layer,
• insulation layers interposed between the data line layer and the ground layer and between the ground layer and the power line layer,
• a plurality of through electrodes which pass through the insulation layer and electrically connect a ground of the active component and the chassis ground,
• a chassis electrode which electrically connects the chassis ground to the chassis case, and
• a protection circuit connected to the active component,
• wherein the protection circuit includes an inductor and a resistor which are connected in series,
• the inductor is disposed in front of the resistor in a direction in which data is transmitted to the active component,
• the plurality of through electrodes connect a ground disposed in a current concentration region to the chassis electrode, and
• a current density of the current concentration region is 1.2 or more times an average current density of the printed circuit board.