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US 2019/0165537 A1Published application
Power interface, and method for manufacturing power interface
AssigneeGuangdong Oppo Mobile Telecommunications Corp., Ltd.
InventorsFeifei LI, Guodong GU
Life of this patent
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Abstract
A method for manufacturing a power interface is provided. The method may includes: providing a pin workblank and disposing the pin workblank on a first mold; and performing a punching shear process on the pin workblank by a second mold, thereby forming a power pin of the power interface without a process of removing burrs. A power interface is also provided.
Claims20
A method for manufacturing a power interface, comprising:
- providing a pin workblank and disposing the pin workblank on a first mold;
- and
- performing a punching shear process on the pin workblank by a second mold, thereby forming a power pin of the power interface without a process of removing burrs.
A method for manufacturing a power interface, comprising:
- providing a pin workblank and disposing the pin workblank on a first mold;
- performing, a punching shear process on the pin workblank by a second mold, thereby forming a power pin of the power interface without a process of removing burrs, wherein the power pin is solid and comprises a first portion having first sidewall surface and a second sidewall surface opposite to each other;
- and
- embedding a plurality of power pins into a connection body having a first connection surface and a second connection surface, such that the first sidewall surface and the second sidewall surface of each of the plurality of power pins extend through the connection body from the first connection surface to the second connection surface.
1 more element
Dependencies are inferred from the claim text.