Electrical contacts on the sidewall of a circuit board
AssigneeInternational Business Machines Corporation
InventorsTodd E. TAKKEN, Xin ZHANG, Yuan YAO, Andrew FERENCZ, Paul W. COTEUS
Life of this patent
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Abstract
Printed circuit board (PCB), electrical structures including PCBs, and methods for making the same. One PCB structures includes: a substrate having a plurality of surfaces, including a first aerial main face (AMF), a second AMF, and a first peripheral end face (PEF), wherein the first PEF separates the first AMF from the second AMF, and a first plurality of contacts embedded in the first PEF, where each of the first plurality of contacts forms a contiguous contact with the first PEF and at least one of i) the second AMF, ii) the first AMF, and iii) another one of the plurality of surfaces.
Claims22
A printed circuit board (PCB) comprising:
- a substrate having a plurality of surfaces, comprising a first areal main face (AMF), a second AMF, a first peripheral end face (PEF), and a second PEF, wherein the first PEF separates the first AMF from the second AMF and is adjacent and perpendicular to the second PEF;
- and
- a first plurality of contacts contiguously extending across a surface of the first PEF, wherein at least one contact of the first plurality of contacts contiguously extends across a surface of the second PEF and extends onto the first AMF.
(canceled)
A structure comprising:
- a first printed circuit board (PCB) including a substrate having a plurality of surfaces including:
- a first areal main face (AMF),
- a second AMF,
- a first peripheral end face (PEF), wherein the first PEF separates the first AMF from the second AMF, and
- a second PEF that is adjacent and perpendicular to the first PEF, wherein the second PEF separates the first AMF from the second AMF;
- and
- a first plurality of contacts contiguously extending across a surface of the first PEF, wherein at least one contact of the first plurality of contacts contiguously extends across a surface of the second PEF and onto the first AMF,
- wherein the first PEF of the first PCB forms an interface with at least one of a first plurality of pads on at least one surface of a second PCB.
(canceled)
A method for forming a printed circuit board (PCB) comprising:
- providing a substrate forming a body of the PCB, having a plurality of surfaces, including:
- a first surface referred to as an areal main face (AMF);
- a second surface perpendicular to the first surface and referred to as a first peripheral end face (PEF);
- and
- a third surface perpendicular to the first surface and the second surface referred to as a second PEF;
- and;
- patterning a plurality of contacts that extends across a surface of the first PEF, wherein at least one contact of the first plurality of contacts contiguously extends across a surface of the second PEF and extends onto the AMF.
Dependencies are inferred from the claim text.