Multilayer directional coupler
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorMyeong Woo HAN
Life of this patent
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Abstract
There is provided a multilayer directional coupler formed in a wireless communications device formed by stacking a plurality of substrates, comprising a first conductive pattern formed on a first substrate among the plurality of substrates; and a second conductive pattern formed on a second substrate stacked on one surface of the first substrate and having one or more conductive lines overlapping the first conductive pattern when viewed in a plane direction.
Claims20
A multilayer directional coupler formed in a wireless communications device formed by stacking a plurality of substrates, the multilayer directional coupler comprising:
- a first conductive pattern formed on a first substrate among the plurality of substrates;
- and
- a second conductive pattern formed on a second substrate stacked on a surface of the first substrate and formed to have one or more conductive lines overlapping the first conductive pattern when viewed in a plane direction.
A multilayer directional coupler formed in a wireless communications device formed by stacking a plurality of substrates, the multilayer directional coupler comprising:
- a first conductive pattern formed on a first substrate among the plurality of substrates;
- a second conductive pattern formed on a second substrate stacked on a surface of the first substrate and formed to have one or more conductive lines overlapping the first conductive pattern when viewed in a plane direction;
- and
- a third conductive pattern formed on a third substrate stacked on a surface of the second substrate and formed to have one or more conductive lines overlapping with at least one of the first conductive pattern and the second conductive pattern when viewed in the plane direction.
A multilayer directional coupler formed in a wireless communications device formed by stacking a plurality of substrates, the multilayer directional coupler comprising:
- a first conductive pattern formed on a first substrate among the plurality of substrates;
- a second conductive pattern formed below a second substrate stacked on a surface of the first substrate and formed to have one or more conductive lines overlapping the first conductive pattern when viewed in a plane direction;
- and
- a capacitor formed to have a first end connected to the first conductive pattern and a second end connected to the second conductive pattern.
Dependencies are inferred from the claim text.