Piezoelectric package-integrated pressure sensing devices
AssigneeIntel Corporation
InventorsThomas L. SOUNART, Feras EID, Sasha N. OSTER, Georgios C. DOGIAMIS, Adel A. ELSHERBINI, Shawna M. LIFF, Johanna M. SWAN
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Abstract
Embodiments of the invention include a pressure sensing device having a membrane that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material positioned in proximity to the membrane, and an electrode in contact with the piezoelectric material. The membrane deflects in response to a change in ambient pressure and this deflection causes a voltage to be generated in the piezoelectric material with this voltage being proportional to the change in ambient pressure.
Claims21
A pressure sensing device, comprising:
- a membrane that is positioned in proximity to a cavity of an organic substrate;
- a piezoelectric material positioned in proximity to the membrane;
- and
- an electrode in contact with the piezoelectric material, wherein the membrane to deflect in response to a change in ambient pressure and this deflection causes a voltage to be generated in the piezoelectric material with this voltage being proportional to the change in ambient pressure.
A package substrate comprising:
- a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate;
- a cavity formed in the package substrate;
- and
- a piezoelectric pressure sensing device integrated within the package substrate, which includes a membrane that is positioned in proximity to the cavity, a piezoelectric material positioned in proximity to the membrane, and first and second electrodes in contact with the piezoelectric material, wherein the membrane to deflect in response to a change in ambient pressure and this deflection causes a voltage to be generated in the piezoelectric material with this voltage being proportional to the change in ambient pressure.
A computing device comprising:
- at least one processor to process data;
- and
- a package substrate coupled to at least one processor, and the package substrate includes a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate which includes a piezoelectric pressure sensing device having a membrane that is positioned in proximity to a cavity of the package substrate, a piezoelectric material positioned in proximity to the membrane, and an electrode in contact with the piezoelectric material, wherein the membrane deflects in response to a change in ambient pressure and this deflection causes a voltage to be generated in the piezoelectric material with this voltage being proportional to the change in ambient pressure.
Dependencies are inferred from the claim text.