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US 2019/0165241 A1Published application
Flip chip integration on qubit chips
AssigneeInternational Business Machines Corporation
InventorsSami Rosenblatt, Jason S. Orcutt, Martin O. Sandberg, Markus Brink, Vivekananda P. Adiga, Nicholas T. Bronn
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Abstract
A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded. The optically transmissive path may provide optical access to the qubit on the first chip.
Claims20
A method for forming a quantum bit (qubit) flip-chip assembly, the method comprising:
- forming a qubit on a first chip;
- forming an optically transmissive path in a second chip;
- and
- bonding the first chip to the second chip;
- and
- wherein the optically transmissive path is located adjacent to the qubit.
3 more elements
A flip chip apparatus comprising:
- a first chip comprising a qubit;
- and
- a second chip bonded to the first chip, wherein an optically transmissive path in the second chip provides for optical access to the qubit on the first chip.
Dependencies are inferred from the claim text.