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US 2019/0165238 A1Published application
Flip chip integration on qubit chips
AssigneeInternational Business Machines Corporation
InventorsSami Rosenblatt, Jason S. Orcutt, Martin O. Sandberg, Markus Brink, Vivekananda P. Adiga, Nicholas T. Bronn
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Abstract
A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded using solder bumps. The optically transmissive path may provide optical access to the qubit on the first chip.
Claims20
A method for forming a quantum bit (qubit) flip-chip assembly, the method comprising:
- forming a qubit on a first chip;
- forming an optically transmissive path in a second chip;
- and
- bonding the first chip to the second chip;
- and
- wherein the optically transmissive path is located above the qubit.
3 more elements
A flip chip apparatus comprising:
- a first chip comprising a qubit;
- a second chip bonded to the first chip, wherein the first chip and the second chip are bonded by a plurality of solder bumps;
- and
- wherein an optically transmissive path in the second chip provides for optical access to the qubit on the first chip.
1 more element
Dependencies are inferred from the claim text.