Resin package and light-emitting device
AssigneeNichia Corporation
InventorsYuta HORIKAWA, Takuya MIKI, Shoichi ISHIKAWA, Ryosuke WAKAKI
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AssigneeNichia Corporation
InventorsYuta HORIKAWA, Takuya MIKI, Shoichi ISHIKAWA, Ryosuke WAKAKI
Estimating the term…
A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.
A resin package comprising:
Dependencies are inferred from the claim text.