# US 2019/0165231 A1 · Method For Making Light Emitting Device LED Arrays > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0165231 A1 - Document ID: US20190165231A1 - Status: Published application - Kind: A1 - Application number: 16/139,292 - Filed: 2018-09-24 - Published: 2019-05-30 - Earliest claimed: 2017-11-27 - Assignees: SemiLEDS Optoelectronics Co., Ltd. - Applicants: SemiLEDs Optoelectronics Co., Ltd. - Inventors: David Trung Doan; Trung Tri Doan - Web page: https://patentgrep.com/patent/US20190165231A1 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/018: {Bonding of wafers} - H10H 20/852: Encapsulations - H10W 90/00: Package configurations - H10H 20/01: Manufacture or treatment - H10H 20/0362: {of encapsulations} - H10H 20/0364: {of interconnections} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate. ## Claims ### Claim 1 A method for making light emitting device LED arrays comprising: providing a plurality of LEDs; attaching the LEDs to a substrate; forming one or more metal layers configured to electrically connect the LEDs to form a desired circuitry; forming one or more insulator layers configured to electrically isolate the metal layers and physically connect the LEDs; and separating the LEDs along with the metal layers and the insulator layers from the substrate. ### Claim 2 (depends on 1) The method of claim 1 wherein the forming of the metal layers step and the forming of the insulator layers step are performed in stages such that a completed LED array has a layered configurations with a desired number of layers. ### Claim 3 (depends on 1) The method of claim 1 wherein the forming of the metal layers step and the forming of the insulator layers step are performed in stages such that a completed LED array has a structural integrity configured to support the LEDs. ### Claim 4 (depends on 1) The method of claim 1 wherein a completed LED array has at least two metal layers and at least two insulator layers. ### Claim 5 The method of 4 wherein the completed LED array includes one or more vias configured to electrically connect the metal layers. ### Claim 6 (depends on 1) The method of claim 1 wherein the substrate comprises a temporary substrate and a carrier substrate, the carrier substrate configured as a support substrate for supporting the LEDs and the temporary substrate configured as an attaching substrate for attaching the LEDs to the support substrate. ### Claim 7 (depends on 1) The method of claim 1 wherein the LEDs comprise an LED selected from the group consisting of VLED, FCLED, HLED and packaged LED. ### Claim 8 (depends on 1) The method of claim 1 wherein the LEDs comprise at least one vertical LED and at least one planar LED. ### Claim 9 (depends on 1) The method of claim 1 wherein the LEDs comprise at least one planar LED. ### Claim 10 (depends on 1) The method of claim 1 further comprising prior to the separating step planarizing at least one insulator layer. ### Claim 11 (depends on 1) The method of claim 1 further comprising prior to the separating step planarizing at least one metal layer. ### Claim 12 (depends on 1) The method of claim 1 further comprising providing the LEDs with extended pads, forming a plurality of metal posts on the temporary substrate in electrical contact with the LEDs and encapsulating the metal posts in an insulator layer. ### Claim 13 (depends on 12) The method of claim 12 further comprising prior to the encapsulating the metal posts step, forming a plurality of electrical connectors in electrical contact with the metal posts and with pads on the LEDs. ### Claim 14 (depends on 13) The method of claim 13 further comprising forming a common electrode in electrical communication with the electrical connectors. ### Claim 15 (depends on 14) The method of claim 14 whereas the common electrode comprises an anode or a cathode ### Claim 16 (depends on 1) The method of claim 1 wherein the LEDS comprise at least one packaged LED. ### Claim 17 A method for making light emitting device LED arrays comprising: providing a plurality of LED dice including at least one vertical LED die VLED; attaching the LED dice to a substrate; forming a plurality of metal posts on the substrate; forming at least one electrical connector in electrical contact with at least one metal post and a contact on the at least one vertical LED die VLED; forming one or more metal layers configured to electrically connect the LED dice in a desired circuitry; forming one or more insulator layers configured to electrically isolate the metal layers and encapsulate the LED dice and the metal posts; and separating the LED dice along with the metal layers and the insulator layers that form the desired circuitry from the substrate. ### Claim 18 (depends on 17) The method of claim 17 further comprising forming a common cathode in electrical communication with the at least one electrical connector. ### Claim 19 (depends on 17) The method of claim 17 further comprising prior to the separating step planarizing at least one insulator layer. ### Claim 20 (depends on 17) The method of claim 17 further comprising attaching or bonding one or more IC chips attached to one metal layer. ### Claim 21 (depends on 17) The method of claim 17 further comprising attaching at least one LED array to a PCB or CCB. ### Claim 22 (depends on 17) The method of claim 17 wherein the substrate comprises a temporary substrate and a carrier substrate, the carrier substrate configured as a support substrate for supporting the LEDs and the temporary substrate configured as an attaching substrate for attaching the LEDs to the support substrate. ### Claim 23 An LED array comprising: a plurality of LED dice including at least three LED dice selected from the group consisting of vertical LED dice VLED, flip chip LED dice FCLED, horizontal LED dice HLED and planar LED dice PLED; a plurality of metal layers and insulator layers on the LED dice configured to electrically connect and support the LED dice in a desired circuitry; and a plurality of extended pads in electrical communication with at least one metal layer configured as an anode or a cathode of the LED array. ### Claim 24 (depends on 23) The LED array of claim 23 wherein the extended pads include a common cathode. ### Claim 25 (depends on 23) The LED array of claim 23 wherein the LED dice comprise packaged LED. ### Claim 26 (depends on 23) The LED array of claim 23 wherein the plurality of LED dice include at least one vertical LED die (VLED) and further comprising at least one metal post and at least one electrical connector in electrical contact with the at least one vertical LED die (VLED). ### Claim 27 (depends on 23) The LED array of claim 23 further comprising a PCB or a CCB connected to at least one completed array. ### Claim 28 (depends on 23) The LED array of claim 23 wherein the LED dice include at least one red LED die, at least one green LED die and at least one blue LED die. ### Claim 29 (depends on 23) The LED array of claim 23 wherein the extended pads include at least a common cathode, a red anode, a green anode, and a blue anode. ### Claim 30 (depends on 23) The LED array of claim 23 wherein the extended pads include at least one common anode, one red cathode, one green cathode, and one blue cathode.