Component having a reflector and method of producing components

A component comprising a semiconductor chip, an envelope and a reflector, wherein

• the semiconductor chip has a front side, a rear side facing away from the front side and side faces, and the semiconductor chip is electrically contactable at least partially via its rear side,
• the reflector completely encloses the semiconductor chip in lateral directions, has a first subregion and a second subregion directly adjoining the first subregion, and the first subregion is spatially spaced from the semiconductor chip and the second subregion directly adjoins the semiconductor chip,
• the envelope covers the front side of the semiconductor chip completely and the side surfaces of the semiconductor chip at least partially so that the envelope has an interface facing the semiconductor chip and reproducing a contour of the semiconductor chip in regions, and
• in the component is free of a lead frame enclosed by a molded body.

A component comprising a semiconductor chip, an envelope and a reflector, wherein

• the semiconductor chip has a front side, a rear side facing away from the front side and side faces, and the semiconductor chip is electrically contactable at least partially via its rear side,
• the reflector completely encloses the semiconductor chip in lateral directions, has a first subregion and a second subregion directly adjoining the first subregion, and the first subregion is spatially spaced from the semiconductor chip and the second subregion directly adjoins the semiconductor chip,
• the envelope covers the front side of the semiconductor chip completely and the side surfaces of the semiconductor chip at least partially so that the envelope has an interface facing the semiconductor chip and reproducing a contour of the semiconductor chip in regions,
• the component has a rear side comprising the rear side of the semiconductor chip and a rear side the reflector,
• for the purpose of external electrical contacting, the semiconductor chip has a freely accessible first contact layer on its rear side, and
• at least in regions, the semiconductor chip is attached to the first subregion of the reflector by the envelope in a mechanically stable manner.

A component comprising a semiconductor chip, an envelope and a reflector, wherein

• the semiconductor chip has a front side, a rear side facing away from the front side and side faces, and the semiconductor chip is electrically contactable at least partially via its rear side,
• the reflector completely encloses the semiconductor chip in lateral directions, has a first subregion and a second subregion directly adjoining the first subregion, the first subregion is spatially spaced from the semiconductor chip and the second subregion directly adjoins the semiconductor chip, and the first subregion and the second subregion have the same material composition,
• the reflector has a cavity whose inner surfaces have different curvatures in different areas, and
• the envelope covers the front side of the semiconductor chip completely and the side surfaces of the semiconductor chip at least partially so that the envelope has an interface facing the semiconductor chip and reproducing a contour of the semiconductor chip in regions.