Ultraviolet light emitting device package

An ultraviolet light emitting device package, comprising:

• a growth substrate, including at least one light emitting window penetrating through the growth substrate in a thickness direction;
• a reflective layer covering an internal wall of the at least one light emitting window;
• a light transmissive cover on one surface of the growth substrate and covering the at least one light emitting window to form a blocked space;
• at least one light emitting structure on the other surface of the growth substrate to cover the at least one light emitting window, and including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, sequentially arranged on the other surface;
• and
• a first electrode and a second electrode, connected to the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer of the at least one light emitting structure, respectively.

An ultraviolet light emitting device package, comprising:

• a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer;
• a growth substrate having one surface in contact with the light emitting structure, the other surface opposing the one surface, and a light emitting window defined by an internal wall penetrating through the one surface and the other surface;
• a reflective layer covering the internal wall;
• a light transmissive cover on the other surface of the light emitting structure and covering the light emitting window;
• and
• a first electrode and a second electrode, connected to the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, respectively.