Semiconductor device and method of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPeng-Soon LIM, Zi-Wei FANG, Cheng-Ming LIN
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Abstract
A semiconductor device includes a semiconductor substrate having a channel region. A gate dielectric layer is over the channel region of the semiconductor substrate. A work function metal layer is over the gate dielectric layer. The work function metal layer has a bottom portion, an upper portion, and a work function material. The bottom portion is between the gate dielectric layer and the upper portion. The bottom portion has a first concentration of the work function material, the upper portion has a second concentration of the work function material, and the first concentration is higher than the second concentration. A gate electrode is over the upper portion of the work function metal layer.
Claims20
A semiconductor device comprising:
- a semiconductor substrate having a channel region;
- a gate dielectric layer over the channel region of the semiconductor substrate;
- a work function metal layer over the gate dielectric layer, wherein the work function metal layer has a bottom portion, an upper portion, and a work function material, the bottom portion is between the gate dielectric layer and the upper portion, the bottom portion has a first concentration of the work function material, the upper portion has a second concentration of the work function material, and the first concentration is higher than the second concentration;
- and
- a gate electrode over the upper portion of the work function metal layer.
A semiconductor device comprising:
- a semiconductor substrate having a channel region;
- a gate dielectric layer over the channel region of the semiconductor substrate;
- a work function metal layer over the gate dielectric layer, wherein the work function metal layer comprises a first work function material;
- and
- a gate electrode over the work function metal layer, wherein at least a portion of the work function metal layer has a concentration of the first work function material reducing in a direction, and the direction is from the gate dielectric layer toward the gate electrode.
A method of fabricating a semiconductor device, the method comprising:
- forming a semiconductor fin;
- forming a gate dielectric layer over the semiconductor fin;
- depositing a first work function metal layer over the gate dielectric layer, the first work function metal layer having a first concentration of a work function material;
- depositing a second work function metal layer over the first work function metal layer, the second work function metal layer having a second concentration of the work function material, wherein the first concentration is higher than the second concentration;
- and
- forming a gate electrode over the second work function metal layer.
Dependencies are inferred from the claim text.