Back to results
US 2019/0165033 A1Published application
Self-alignment of a pad and ground in an image sensor
AssigneeOmniVision Technologies, Inc.
InventorsQin Wang, Gang Chen, Duli Mao
Life of this patent
Estimating the term…
Abstract
An image sensor includes a plurality of photodiodes disposed in a semiconductor material to convert image light into image charge, and a metal grid, including a metal shield that is coplanar with the metal grid, disposed proximate to a backside of the semiconductor material. The metal grid is optically aligned with the plurality of photodiodes to direct the image light into the plurality of photodiodes, and a contact pad is disposed in a trench in the semiconductor material. The contact pad is coupled to the metal shield to ground the metal shield.
Claims10
An image sensor, comprising:
- a plurality of photodiodes disposed in a semiconductor material to convert image light into image charge;
- a metal grid, including a metal shield that is coplanar with the metal grid, disposed proximate to a backside of the semiconductor material, wherein the metal grid is optically aligned with the plurality of photodiodes to direct the image light into the plurality of photodiodes;
- and
- a contact pad disposed in a trench in the semiconductor material, and wherein the contact pad is coupled to the metal shield to ground the metal shield.
1 more element
Dependencies are inferred from the claim text.