Semiconductor package and camera module

A semiconductor package of a wafer level chip size package type, the semiconductor package comprising at least three terminals, wherein

• the semiconductor package has a long and narrow rectangular shape as viewed in plan,
• the three terminals are individually arranged in such a manner that an each center of the three terminals in a longitudinal direction of the semiconductor package is not overlapped and the each center of the three terminals in a longitudinal direction of the semiconductor package and an each center in the longitudinal direction of other terminals arranged on the semiconductor package are not overlapped with each other as viewed from a side of a long side of the semiconductor package,
• one terminal and other two terminals among the three terminals are present on different sides across a line segment passing through a center in a width direction of the semiconductor package,
• an angle formed by two line segments connecting a gravity of the terminal positioned in a center in the longitudinal direction, among the three terminals and a gravity of each of the other two terminals is 60° or more, and
• a width L1 of the semiconductor package and a distance Lt between a rightmost end position of the terminal arranged at the rightmost end in the width direction of the semiconductor package among the three terminals and a leftmost end position of the terminal arranged at the leftmost end in the width direction satisfy Lt/L1≥0.5.