Image sensing chip package and image sensing chip packaging method
AssigneeChina Wafer Level CSP Co., Ltd.
InventorZhiqi Wang
Life of this patent
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Abstract
An image sensing chip package and an image sensing chip packaging method are provided. In the image sensing chip package, an image sensing chip is located in a through hole of a substrate, and a front surface of the image sensing chip is flush with a first surface of the substrate. In this way, in the image sensing chip package, a height of the image sensing chip is controlled with the first surface of the substrate as a reference. Since the first surface of the substrate does not change in the packaging process, almost no uncontrollable factor affects the height of the image sensing chip.
Claims22
An image sensing chip package, comprising:
- a substrate;
- and
- one or more image sensing chips, wherein
- the substrate comprises a first surface and a second surface opposite to each other, one or more through holes penetrating the first surface and the second surface are formed on the substrate, first contact pads electrically connected to front surfaces of the image sensing chips are provided on the first surface, second contact pads used to be electrically connected to an external circuit are provided on the second surface of the substrate, electrical connection structures for electrically connecting the first contact pads with the second contact pads are provided in the substrate;
- and
- the image sensing chips are located in the through holes, with the front surfaces of the image sensing chips being flush with the first surface of the substrate, and the front surface of each of the image sensing chips is provided with a photosensitive region and third contact pads located on the periphery of the photosensitive region, each of the third contact pads is electrically connected to one of the first contact pads via a wire.
An image sensing chip packaging method, comprising:
- providing a substrate, wherein the substrate comprises a first surface and a second surface opposite to each other, first contact pads electrically connected to front surfaces of one or more image sensing chips are provided on the first surface, second contact pads used to be electrically connected to an external circuit are provided on the second surface of the substrate, electrical connection structures for electrically connecting the first contact pads with the second contact pads are provided in the substrate;
- forming one or more through holes penetrating the first surface and the second surface on the substrate, wherein each of the through holes is arranged to accommodate at least one of the image sensing chips;
- forming a covering layer for enclosing openings of the through holes facing towards the first surface on the first surface of the substrate;
- placing the image sensing chips in the through holes, wherein the front surfaces of the image sensing chips are in contact with a surface of the covering layer, and the front surface of each of the image sensing chips is provided with a photosensitive region and third contact pads located on the periphery of the photosensitive region;
- connecting the image sensing chips with the substrate to form an integrated structure of the image sensing chips and the substrate;
- removing the covering layer;
- and
- electrically connecting each of the third contact pads with the first contact pad corresponding to the third contact pad via a wire.
Dependencies are inferred from the claim text.