Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device

A molded photosensitive assembly, comprising:

• at least one circuit board having at least one chip mounting area;
• at least one photosensitive element, provided on said at least one chip mounting area of said at least one circuit board, having a photosensitive area and a non-photosensitive area;
• at least a set of wires, wherein two ends of each of said set of wires are respectively connected to said at least one photosensitive element and said at least one circuit board;
• at least one supporting member formed by a first substance;
• and
• at least one molded base formed by a second substance, wherein said at least one module base comprises a molded body and has at least one light window, wherein said set of wires, said at least one circuit board and said at least one photosensitive element are protected by said at least one supporting member when and after said at least one molded body is molded, wherein said at least one molded body is integrally coupled to cover at least a part of said at least one circuit board and at least a part of said non-photosensitive area of said at least one photosensitive element, wherein said photosensitive area of said at least one photosensitive element is positioned corresponding said at least one light window of said at least one molded base.

A manufacturing method of a molded photosensitive assembly, comprising the steps of:

• (a) electrically connecting at least one photosensitive element with at least one circuit board through a set of wires, wherein said at least one photosensitive element is provided on a chip mounting area of said at least one circuit board;
• (b) placing said at least one photosensitive element and said at least one circuit board in a molding cavity of a molding-die which comprises an upper mold and a lower mold, wherein said molding cavity is formed between said lower mold and said upper mold when said upper mold and said lower mold are closed and clamped;
• (c) when a molding material is added in said molding cavity, reducing an impact force generated by said molding material with at least one supporting member provided in said molding cavity to block said molding material;
• and
• (d) forming at least one molded base after said molding material is solidified and cured, wherein said at least one molded base comprises a molded body and has a light window positioned corresponding to a photosensitive area of said at least one photosensitive element, wherein a periphery area of said at least one circuit board, said at least one supporting member and at least a part of a non-photosensitive area of said at least one photosensitive element are covered by said molded body.