Package for iris recognition imaging module and manufacturing method thereof

A method for manufacturing a package for an iris recognition imaging module, comprising:

• providing a base, wherein the base comprises a plurality of substrates arranged in an array, a cutting trench is formed between adjacent substrates among the plurality of substrates, each of the plurality of substrates comprises a window region and a wiring region surrounding the window region, the wiring region is provided with a wiring line, and each of the plurality of substrates has a first surface and a second surface opposite to each other;
• forming a window in the window region of each of the plurality of substrates;
• bonding an image sensing chip on the first surface of each of the plurality of substrates, to electrically connect the image sensing chip with the wiring line, wherein the image sensing chip comprises an image sensing region, the image sensing region faces towards the window and is covered by the window;
• bonding an infrared light-emitting diode (LED) on the second surface of each of the plurality of substrates, wherein the infrared LED is electrically connected with the wiring line;
• fixing a shielding member on the second surface of each of the plurality of substrates, wherein the shielding member is configured to prevent at least a part of infrared light emitted by the infrared LED from entering the image sensing region;
• and
• cutting the base along the cutting trench.