Imaging detector module assembly

A method for producing an imaging system detector array module assembly with a module assembly device, wherein the module assembly device includes a base with a recess having a first surface and side walls protruding therefrom, a photo-detector array tile support extending from the side walls, and a heat sink, the method comprising:

• receiving a module substrate on the surface of the assembly device, the module substrate including an opening;
• receiving a photo-detector array tile with an ASIC mounted thereto, wherein the photo-detector array tile is received directly over the module substrate with the ASIC in the opening above the heat sink of the module assembly device, and the photo-detector array tile includes a solder in a region of a side facing the module substrate;
• applying heat to the module assembly device;
• and
• concurrently, removing heat from a bond between the photo-detector array tile and the ASIC with the heat sink and reflowing the solder to bond the photo-detector array tile to the module substrate, which produces the module assembly.

A method for producing an imaging system detector array module assembly with a module assembly device, wherein the module assembly device includes a base with a recess having a first surface and side walls protruding therefrom, and a photo-detector array tile support extending from the side walls, the method comprising:

• receiving a module substrate on the surface of the assembly device, the module substrate including a recess and a heat sink disposed under the recess;
• receiving a photo-detector array tile with an ASIC mounted thereto, wherein the photo-detector array tile is received directly over the module substrate with the ASIC in the recess, and the photo-detector array tile includes a solder in a region of a side facing the module substrate;
• applying heat to the module assembly device;
• and
• concurrently, removing heat from a bond between the photo-detector array tile and the ASIC with the heat sink of the module substrate and reflowing the solder to bond the photo-detector array tile to the module substrate, which produces the module assembly.