Semiconductor package of package on package type

A semiconductor package comprising:

• a first sub-package comprising:
• a first package base substrate,
• a first semiconductor chip on the first package base substrate,
• a first molding member on the first package base substrate and surrounding the first semiconductor chip, and
• an electromagnetic wave shielding member covering a top surface of the first molding member, side surfaces of the first molding member, and side surfaces of the first package base substrate, wherein the first sub-package has a groove space extending inward from a bottom surface of the first package base substrate;
• and
• a second sub-package provided in the groove space and comprising:
• a second package base substrate,
• a second semiconductor chip on the second package base substrate, and
• a second molding member on the second package base substrate and surrounding the second semiconductor chip,
• wherein a bottom surface of the first sub-package and a bottom surface of the second sub-package are at a same height.

A semiconductor package comprising:

• a first sub-package comprising:
• a first package base substrate on which a first semiconductor chip is mounted,
• an upper molding member on a top surface of the first package base substrate and surrounding the first semiconductor chip, and
• an electromagnetic wave shielding member covering a top surface of the upper molding member, side surfaces of the upper molding member, and side surfaces of the first package base substrate;
• and
• a second sub-package comprising a second package base substrate on which a second semiconductor chip is mounted,
• wherein the first sub-package has a groove space extending inward from a bottom surface of the first sub-package, and
• wherein side surfaces of the second sub-package and inner side surfaces of the groove space are spaced apart from each other in the groove space.