# US 2019/0164931 A1 · Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0164931 A1 - Document ID: US20190164931A1 - Status: Published application - Kind: A1 - Application number: 16/150,362 - Filed: 2018-10-03 - Published: 2019-05-30 - Earliest claimed: 2017-11-29 - Assignees: Kulicke and Soffa Industries, Inc. - Applicants: Kulicke and Soffa Industries, Inc. - Inventors: Ai Jun Song; Daniel P. Buergi; Horst Clauberg; Matthew E. Tarabulski; Matthew B. Wasserman - Web page: https://patentgrep.com/patent/US20190164931A1 ## CPC - B23K 3/04: Heating appliances - B23K 1/0016: {Soldering of electronic components} - B23K 3/047: electric - B23K 2101/40: Semiconductor devices - B23K 2103/56: {being semiconducting} - H05K 2201/10674: Flip chip - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07178: {Means for aligning} - H10W 72/07232: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07236: {Soldering or alloying} - H10W 72/07332: {Compression bonding, e.g. thermocompression bonding} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region. ## Claims ### Claim 1 A bonding tool for bonding a semiconductor element to a substrate on a bonding machine, the bonding tool comprising: a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine, the body portion defining a non-contact region adjacent the contact region; and a heat resistant coating applied to the non-contact region. ### Claim 2 (depends on 1) The bonding tool of claim 1 wherein the heat resistant coating includes a low heat emissivity material. ### Claim 3 (depends on 1) The bonding tool of claim 1 wherein the heat resistant coating includes a low thermal conductivity material. ### Claim 4 (depends on 1) The bonding tool of claim 1 wherein the heat resistant coating includes a plurality of layers. ### Claim 5 (depends on 4) The bonding tool of claim 4 wherein the plurality of layers includes a low heat emissivity layer and a low thermal conductivity layer. ### Claim 6 (depends on 5) The bonding tool of claim 5 wherein the low heat emissivity layer is provided on the low thermal conductivity layer. ### Claim 7 (depends on 1) The bonding machine of claim 1 wherein the heat resistant coating has an emissivity of between 0.02 and 0.5. ### Claim 8 (depends on 1) The bonding tool of claim 1 wherein the heat resistant coating is applied to the body portion using at least one of sputtering or electroplating. ### Claim 9 (depends on 1) The bonding tool of claim 1 wherein the heat resistant coating includes gold. ### Claim 10 (depends on 1) The bonding tool of claim 1 wherein the bonding tool is a placement tool for use in a thermocompression bonding operation on the bonding machine. ### Claim 11 (depends on 1) The bonding tool of claim 1 wherein the bonding tool is a heated bonding tool for heating the semiconductor element. ### Claim 12 (depends on 1) The bonding tool of claim 1 wherein the bonding tool is engaged with a distinct heater for heating the semiconductor element. ### Claim 13 (depends on 1) The bonding tool of claim 1 wherein the non-contact region is a stepped region. ### Claim 14 (depends on 1) The bonding tool of claim 1 wherein the heat resistant coating is also applied to the contact region. ### Claim 15 A bonding machine for bonding a semiconductor element to a substrate, the bonding machine comprising: a bonding tool, the bonding tool including a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine, the body portion defining a non-contact region adjacent the contact region, the bonding tool also including a heat resistant coating applied to the non-contact region; and a support structure for supporting the substrate. ### Claim 16 (depends on 15) The bonding machine of claim 15 further comprising a bond head assembly for carrying the bonding tool. ### Claim 17 (depends on 15) The bonding machine of claim 15 wherein the bonding tool is a placement tool for use in a thermocompression bonding operation on the bonding machine. ### Claim 18 (depends on 15) The bonding machine of claim 15 wherein the heat resistant coating includes a low heat emissivity material. ### Claim 19 (depends on 15) The bonding machine of claim 15 wherein the heat resistant coating includes a low thermal conductivity material. ### Claim 20 (depends on 15) The bonding machine of claim 15 wherein the heat resistant coating is applied also to the contact region. ### Claim 21 A method of processing a bonding tool, the method comprising the steps of: (a) providing a bonding tool, the bonding tool including a body portion including a contact region for contacting a semiconductor element during a bonding process on a bonding machine, the body portion defining a non-contact region adjacent the contact region; and (b) applying a heat resistant coating to the non-contact region. ### Claim 22 (depends on 21) The method of claim 21 wherein the heat resistant coating includes a low heat emissivity material, and wherein step (b) includes applying the low heat emissivity material to the non-contact region. ### Claim 23 (depends on 21) The method of claim 21 wherein the heat resistant coating includes a low thermal conductivity material, and wherein step (b) includes applying the low thermal conductivity material to the non-contact region. ### Claim 24 (depends on 21) The method of claim 21 wherein the heat resistant coating includes a plurality of layers, and wherein step (b) includes (i) applying a first of the plurality of layers to the non-contact region and (ii) applying a second of the plurality of layers to the first layer on the non-contact region. ### Claim 25 (depends on 24) The method of claim 24 wherein the first of the plurality of layers is a low thermal conductivity layer, and the second of the plurality of layers is a low heat emissivity layer. ### Claim 26 (depends on 21) The method of claim 21 wherein step (b) including also applying the heat resistant coating to the contact region.