Systems and methods for semi-flexible eutectic bonder piece arrangments

A system, comprising:

• a frame comprising a first side and a second side opposite the first side, wherein the frame comprises an aperture formed therethrough;
• an insert disposed within the aperture, the insert configured to support eutectic bonding of wafers when heated;
• two clamps disposed on the first side, wherein the two clamps are configured to secure the wafers at respective clamp locations;
• and
• a plurality of both fixed pieces and flexible pieces configured to secure the insert within the aperture, wherein the plurality of both fixed pieces and flexible pieces comprises two fixed pieces that are disposed respectively adjacent to the clamp locations along the second side of the frame.

A method, comprising:

• providing a first wafer and a second wafer;
• securing the first wafer and the second wafer to an insert at clamp locations using two clamps disposed on a first side of a circular frame, wherein the circular frame defines an aperture;
• and
• securing the insert within the aperture using a plurality of both fixed pieces and flexible pieces, wherein the plurality of both fixed pieces and flexible pieces comprises two fixed pieces that are disposed respectively adjacent to the clamp locations along a second side of the circular frame.