US 2019/0164927 A1 · Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Abstract

A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

Claims21

Dependent claims

A bonding wire for a semiconductor device comprising:

a Cu alloy core material;
and
a Pd coating layer formed on a surface of the Cu alloy core material, wherein
the bonding wire contains at least one or more first elements selected from Sb, Bi and Se,
a concentration of the first elements in total is 0.1 ppm by mass or more and 100 ppm by mass or less relative to the entire wire, and
Sb≤10 ppm by mass;
and Bi≤1 ppm by mass, and
the bonding wire contains at least one or more second elements selected from Ni, Zn, Rh, In, Ir, Pt, Ga and Ge, and
a concentration of each of the second elements is 0.011% by mass or more and 1.2% by mass or less relative to the entire wire.

6 more elements

Dependencies are inferred from the claim text.

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Life of this patent

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Life of this patent

Abstract

Claims21