Semiconductor structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJie Chen, Hsien-Wei Chen, Ying-Ju Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor structure including an insulating encapsulant, a plurality of semiconductor dies separately embedded in the insulating encapsulant, and an electrical communication path is provided. The electrical communication path includes at least one turning wiring connected to a conductive terminal of one of the semiconductor dies and extending across and above the insulating encapsulant to reach another conductive terminal of another one of the semiconductor dies. A layout area of the at least one turning wiring is within a region corresponding to an edge of one of the semiconductor dies and a closest edge of the adjacent one of the semiconductor dies.
Claims20
A semiconductor structure, comprising:
- an insulating encapsulant;
- a plurality of semiconductor dies separately embedded in the insulating encapsulant;
- and
- an electrical communication path comprising at least one turning wiring connected to a conductive terminal of one of the semiconductor dies and extending across and above the insulating encapsulant to reach another conductive terminal of another one of the semiconductor dies, wherein a layout area of the at least one turning wiring is within a region corresponding to an edge of one of the semiconductor dies and a closest edge of the adjacent one of the semiconductor dies.
A semiconductor structure, comprising:
- a first semiconductor die and a second semiconductor die disposed side by side;
- an insulating encapsulant interposed between the first semiconductor die and the second semiconductor die, comprising a top width and a bottom width less than the top width, wherein a shortest distance between a first conductive terminal of the first semiconductor die and a second conductive terminal of the second semiconductor die is greater than the top width of the insulating encapsulant;
- and
- a conductive trace electrically connected to the first conductive terminal of the first semiconductor die and the second conductive terminal of the second semiconductor die, and comprising a turning segment located above the insulating encapsulant.
A semiconductor structure, comprising:
- an insulating encapsulant;
- a plurality of semiconductor dies spatially apart by the insulating encapsulant, each of the semiconductor dies comprising a conductive terminal accessibly exposed by the insulating encapsulant;
- and
- a redistribution circuit connected to the conductive terminals of the semiconductor dies, the redistribution circuit horizontally and vertically extending beyond external perimeters of the conductive terminals of the semiconductor dies to have a total length greater than a shortest distance between the conductive terminals of the two adjacent semiconductor dies.
Dependencies are inferred from the claim text.