Substrate device, electronic apparatus, and method for manufacturing substrate device
AssigneeSony Corporation
InventorSHIGEKAZU ISHII
Life of this patent
Estimating the term…
Abstract
[Object] To provide a substrate device, an electronic apparatus, and a method for manufacturing a substrate device that can make large the gap between a semiconductor substrate and a wiring substrate by making the height of a solder ball high. [Solution] A substrate device includes: a substrate; an electrical connection unit provided on the substrate; a metal post provided on the electrical connection unit; and a metal film that is provided in one body from a tip surface to at least part of a side surface of the metal post and of which wettability to a solder material is lower than wettability to the solder material of the metal post.
Claims16
A substrate device comprising:
- a substrate;
- an electrical connection unit provided on the substrate;
- a metal post provided on the electrical connection unit;
- and
- a metal film that is provided in one body from a tip surface to at least part of a side surface of the metal post and of which wettability to a solder material is lower than wettability to the solder material of the metal post.
An electronic apparatus comprising:
- a mounting structure of a semiconductor device,
- the mounting structure including
- a first substrate including a first electrical connection unit on a substrate surface,
- a second substrate including a second electrical connection unit on a substrate surface,
- a metal post provided on the first electrical connection unit,
- a solder ball that electrically connects the second electrical connection unit and the metal post together,
- a metal film that is provided between the metal post and the solder ball in one body from a tip surface to at least part of a side surface of the metal post and of which wettability to the solder ball is lower than wettability to the solder ball of the metal post, and
- a sealing resin put in a gap between the first substrate and the second substrate.
A method for manufacturing a substrate device, comprising:
- forming, on a substrate including an electrical connection unit on a substrate surface, a photosensitive material layer having an opening portion superimposed on the electrical connection unit;
- forming a metal post in the opening portion of the photosensitive material layer;
- subjecting the photosensitive material layer to light exposure treatment by using a photomask having a light transmissive portion that is superimposed on the opening portion of the photosensitive material layer and further has a larger outer diameter than the opening portion;
- forming a metal film of which wettability to a solder material is lower than wettability to the solder material of the metal post, in one body from a tip surface to at least part of a side surface of the metal post;
- and
- removing the photosensitive material layer.
Dependencies are inferred from the claim text.