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US 2019/0164921 A1Published application
Conductive pillar shaped for solder confinement
AssigneeInternational Business Machines Corporation
InventorsCharles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter
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Abstract
A pillar-type connection includes a first conductive layer that includes a hollow core. A second conductive layer is connected to the first conductive layer defining a conductive pillar that includes a top surface defining a recess aligned with the hollow core. A conductive via terminates at a top surface of the first conductive layer.
Claims20
A pillar-type connection comprising:
- a first conductive layer that includes a hollow core;
- a second conductive layer coupled to the first conductive layer defining a conductive pillar that includes a top surface defining a recess aligned with the hollow core;
- and
- a conductive via that terminates at a top surface of the first conductive layer.
1 more element
A pillar-type connection comprising:
- a first conductive layer that includes a hollow core;
- a second conductive layer coupled to the first conductive layer defining a conductive pillar that includes a top surface defining a recess aligned with the hollow core;
- a conductive via that terminates at a top surface of the first conductive layer;
- and
- a plating mask that includes an opening aligned with the conductive via.
2 more elements
Dependencies are inferred from the claim text.