Back to results
US 2019/0164916 A1Published application
Semiconductor package device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsShao-En HSU, Huei-Shyong CHO, Shih-Wen LU
Life of this patent
Estimating the term…
Abstract
An antenna semiconductor package device includes: (1) a waveguide cavity having a radiation opening; and (2) a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.
Claims11
An antenna semiconductor package device, comprising:
- a waveguide cavity having a radiation opening;
- and
- a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.
Dependencies are inferred from the claim text.