Seal Ring for Hybrid-Bond
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen, Hsien-Wei Chen
Life of this patent
Estimating the term…
Abstract
A structure includes a first die and a second die. The first die includes a first oxide bonding layer having a first plurality of bond pads disposed therein and a first seal ring disposed in the first oxide bonding layer. The first oxide bonding layer extends over the first seal ring. The second die includes a second oxide bonding layer having a second plurality of bond pads disposed therein. The first plurality of bond pads is bonded to the second plurality of bond pads. The first oxide bonding layer is bonded to the second oxide bonding layer. An area interposed between the first seal ring and the second oxide bonding layer is free of bond pads.
Claims20
A structure comprising:
- a first die, the first die comprising:
- a first oxide bonding layer having a first plurality of bond pads disposed therein, and
- a first seal ring disposed in the first oxide bonding layer, wherein the first oxide bonding layer extends over the first seal ring;
- and
- a second die, the second die comprising:
- a second oxide bonding layer having a second plurality of bond pads disposed therein, wherein the first plurality of bond pads is bonded to the second plurality of bond pads, wherein the first oxide bonding layer is bonded to the second oxide bonding layer, and wherein an area interposed between the first seal ring and the second oxide bonding layer is free of bond pads.
A method, comprising:
- determining an alignment of a first die to a second die by aligning active bond pads of the first die to corresponding active bond pads of the second die, wherein a first area of the first die and a second area of the second die are aligned with a seal ring of the second die;
- removing all bond pads in the first area of the first die;
- removing all bond pads in the second area of the second die;
- and
- bonding the first die to the second die according to the alignment.
A method comprising:
- determining a first device layout of bond pads disposed at a surface of a first device;
- determining a second device layout of bond pads disposed at a surface of a second device, the second device having a seal ring;
- determining an alignment which aligns a first active bond pad of the first device to a second active bond pad of the second device, wherein the alignment causes the seal ring to align with a first region of the first die;
- removing first bond pads in the first region from the first device layout of bond pads;
- removing second bond pads in a second region of the second device, wherein the second bond pads align with the first bond pads according to the alignment;
- bonding the first active bond pad to the second active bond;
- and
- bonding the first region to the second region.
Dependencies are inferred from the claim text.