Semiconductor chip and semiconductor package having the same

A semiconductor package comprising:

• a circuit board including an electric circuit pattern;
• a first semiconductor chip on the circuit board and electrically connected to the circuit board;
• and
• a second semiconductor chip on the first semiconductor chip and electrically connected to the first semiconductor chip, each of first and the second semiconductor chips including,
• a substrate including a plurality of chip areas and a line-shaped scribe area defining the chip areas,
• an integrated circuit (IC) structure on the chip area, the IC structure including a plurality of transistors and a plurality of stacked wiring structures connected to the transistors, and
• a warpage protector in the line-shaped scribe area and corresponding to the stacked wiring structures, the warpage protector supporting at least a side of the IC structure.

A semiconductor package comprising:

• a mother board including an electronic circuit pattern;
• a system on chip (SoC) package on the mother board, the SOC package including an operational chip, the operational chip including one or more microprocessors;
• and
• a multichip package on the SoC package, the multichip package including a controller and at least one memory chip, each of the operational chip and the memory chip including,
• a substrate including a plurality of chip areas and a line-shaped scribe area defining the chip areas,
• an integrated circuit (IC) structure on the chip area, the IC structure including a plurality of transistors and a plurality of stacked wiring structures connected to the transistors, and
• a warpage protector in the line-shaped scribe area and corresponding to the stacked wiring structures, the warpage protector supporting at least one side of the IC structure.