Fan-out semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Bo LEE, Joon Seok OH, Hyun Chul JUNG, Jeong Ho YEO
Life of this patent
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Abstract
A fan-out semiconductor package includes a first connection member having a through-hole first and second semiconductor chips disposed in the through-hole, an encapsulant encapsulating the first and second semiconductor chips, a second connection member disposed on at least one side of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second semiconductor chips, and an insulating via in which at least a portion of the first connection member is removed in a thickness direction and is filled with an insulating material.
Claims18
A fan-out semiconductor package comprising:
- a first connection member having a through-hole;
- first and second semiconductor chips disposed in the through-hole;
- an encapsulant encapsulating the first and second semiconductor chips;
- a second connection member disposed on at least one side of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second semiconductor chips;
- and
- an insulating via extending through at least a portion of the first connection member in a thickness direction and being filled with an insulating material.
A fan-out semiconductor package comprising:
- a first connection member having a first through-hole and a second through-hole;
- a first semiconductor chip and a second semiconductor chip disposed respectively in the first and second through-holes, the first semiconductor chip having a size different from that of the second semiconductor chip;
- an encapsulant disposed in the first and second through-holes and encapsulating the first and second semiconductor chips such that an amount of the encapsulant in the first through-hole is less than an amount of the encapsulant in the second through-hole;
- a second connection member disposed on at least one side of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second semiconductor chips;
- and
- an insulating via extending through at least a portion of the first connection member and being filled with an insulating material,
- wherein the insulating via is disposed adjacent the first through-hole and away from the second through-hole.
Dependencies are inferred from the claim text.