Semiconductor package and method for manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCHEN-SHIEN CHEN, MING-DA CHENG, MING-CHIH YEW, YU-TSE SU
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a die including a first surface and a second surface opposite to the first surface, a warpage control unit disposed over the second surface of the die and entirely overlapping the second surface of the die, and a molding compound surrounding the die and the warpage control unit. The warpage control unit includes an adhesive portion disposed over the second surface of the die and a warpage adjustable portion sandwiched between the adhesive portion and the die.
Claims20
A semiconductor package comprising:
- a die comprising a first surface and a second surface opposite to the first surface;
- a warpage control unit disposed over the second surface of the die and entirely overlapping the second surface, wherein the warpage control unit comprises:
- an adhesive portion disposed over the second surface of the die;
- and
- a warpage adjustable portion sandwiched between the adhesive portion and the die;
- and
- a molding compound surrounding the die and the warpage control unit.
A semiconductor package comprising:
- a die comprising a first surface and a second surface opposite to the first surface, wherein the die comprises a first coefficient of thermal expansion (CTE);
- a polymeric film disposed over the second surface of the die and comprising a second CTE;
- an adhesive film disposed over the polymeric film and comprising a third CTE;
- a molding compound surrounding the die, the polymeric film and the adhesive film;
- and
- an interconnect structure over the first surface of the die and the molding compound,
- wherein the second CTE of the polymeric film is between the third CTE of the adhesive film and the first CTE of the die.
A method for manufacturing a semiconductor package, comprising:
- providing a die comprising a first surface and a second surface opposite to the first surface;
- disposing a polymeric film over the second surface of the die;
- providing an adhesive film;
- attaching the die and the polymeric film to a carrier substrate through the adhesive film;
- and
- molding the die, the polymeric film and the adhesive film with a molding compound,
- wherein the polymeric film is sandwiched between the die and the adhesive film upon attaching to the carrier substrate.
Dependencies are inferred from the claim text.