Semiconductor device and method for manufacturing the same

A semiconductor device comprising:

• an electroconductive shielding layer;
• an isolation layer formed on the shielding layer and comprising a frame-shaped opening as viewed in a thickness direction;
• a wiring layer disposed on the isolation layer so as to be surrounded by the opening;
• a semiconductor element having an element front surface and an element back surface that are opposite to each other in the thickness direction, the semiconductor element being disposed on the wiring layer with the element back surface facing the wiring layer;
• electroconductive pillars spaced apart from the semiconductor element and standing on the wiring layer in the thickness direction;
• an electroconductive frame standing on a region of the shielding layer exposed through the opening in the thickness direction, the frame surrounding the semiconductor element and the electroconductive pillars as viewed in the thickness direction;
• and
• an electrically insulating sealing resin covering the wiring layer and the semiconductor element,
• wherein the frame is configured to be electrically connected to an external ground terminal.