Multilayer circuit board
AssigneeTDK Corporation
InventorsMasashi KATSUMATA, Yoshihiro SUZUKI, Reo HANADA
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Abstract
Disclosed herein is a multilayer circuit board that includes a plurality of conductor layers laminated with insulating layers interposed therebetween. The plurality of conductor layers include a first conductor layer, a second conductor layer, and a first shield layer disposed between the first and second conductor layers. The first shield layer is smaller in conductor thickness than the first and second conductor layers and is connected to none of the plurality of conductor layers within its surface.
Claims15
A multilayer circuit board comprising a plurality of conductor layers laminated with insulating layers interposed therebetween,
- wherein the plurality of conductor layers include a first conductor layer, a second conductor layer, and a first shield layer disposed between the first and second conductor layers, and
- wherein the first shield layer is smaller in conductor thickness than the first and second conductor layers and is connected to none of the plurality of conductor layers within its surface.
A multilayer circuit board comprising:
- a first conductor layer including a first conductor pattern;
- a second conductor layer including a first conductor pattern;
- a shield layer disposed between the first and second conductor layers, the shield layer including a third conductor pattern having a clearance region where the third conductor pattern is removed;
- and
- a via conductor provided so as to pass through the clearance region to connect the first conductor pattern to the second conductor pattern.
Dependencies are inferred from the claim text.