Array substrate, chip on film, and alignment method
AssigneeKunShan Go-Visionox Opto-Electronics Co., Ltd
InventorsRenjie Liu, Xiangqian Wang, Lingyan Chen
Life of this patent
Estimating the term…
Abstract
Embodiments of the present application provide an array substrate, a chip on film and an alignment method. The array substrate includes a first pin correspondingly connected with a second pin on a chip on film; a first alignment mark located in a preset alignment range of the first pin and aligned with a second alignment mark on the chip on film; and a first offset mark located in the preset alignment range of the first pin, obtained according to the first alignment mark and the second alignment mark and configured to indicate an alignment deviation between the first pin and the second pin.
Claims12
An array substrate, comprising:
- at least one first pin correspondingly connected with at least one second pin on a chip on film;
- a first alignment mark located in a preset alignment range of the first pin and aligned with a second alignment mark on the chip on film;
- and
- a first offset mark located in the preset alignment range of the first pin, obtained according to the first alignment mark and the second alignment mark, an alignment deviation between the first pin and the second pin being indicated via the first offset mark.
A chip on film, comprising:
- at least one second pin correspondingly connected with at least one first pin on an array substrate;
- a second alignment mark located in a preset alignment range of the second pin and aligned with a first alignment mark on the array substrate;
- and
- a second offset mark located in the preset alignment range of the second pin, obtained according to the first alignment mark and the second alignment mark and indicating an alignment deviation between the first pin and the second pin.
An alignment method, comprising:
- correspondingly connecting a first pin on a first device with a second pin on a second device;
- aligning a first alignment mark on the first device with a second alignment mark on the second device;
- obtaining a first offset mark according to the first alignment mark and the second alignment mark;
- indicating an alignment deviation between the first pin and the second pin with the first offset mark;
- and
- aligning the first device and the second device according to the alignment deviation.
Dependencies are inferred from the claim text.