Module and method for producing a plurality of modules

The module according to the previous claim,

• wherein at least one of the components of the module (1, 2), on a side facing the other component of the module (1, 2), has a rewiring layer (7) having a metal coating (8), by means of which the module components are electrically connected (1, 2) together.

The module in accordance with any one of the preceding claims,

• wherein at least one of the components of the module (1, 2), in each case, on its under side (11, 17) and on its opposite upper side (6, 18) has a rewiring layer (7), wherein the rewiring layers (7) are connected with a plated through hole (12) that extends through the component of the module (1, 2).

The module in accordance with any one of the preceding claims,

• wherein an acoustic wave filter is the first structural element (4) and/or the second structural element (16).

The module in accordance with any one of the preceding claims,

• wherein the lower component of the module (1) has metal columns (13) on the upper side (6) facing the upper component of the module (2),
• wherein the upper component of the module (2) has metal columns (13) on its under side (17) facing the lower component of the module (1).
• wherein the metal columns (13) of the lower component of the module (1) and the metal columns (13) of the upper component of the module (2) are connected.

The module in accordance with any one of the preceding claims,

• wherein a metallization (23, 24) is arranged on an exterior surface of the module which allows an electromagnetic shielding of the module or which is used to dissipate heat from the module.

The module in accordance with any one of the preceding claims,

• wherein a metallization (22) that forms an antenna structure is arranged on an exterior surface of the module.

The module in accordance with any one of the preceding claims,

• wherein at least one other component of the module that has a material (3) in which at least a third structural component is embedded is arranged on the upper side (18) of the upper component of the module (2), which is directed away from the lower component of the module (1).

The module in accordance with any one of the preceding claims,

• wherein the material (3) in which the first and the second structural element (4, 16) are embedded is a prepreg material or a molding material.

The module in accordance with any one of the preceding claims,

• wherein the first and/or the second structural element (4, 16) is selected from a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip or a MEMS device.

The module in accordance with any one of the preceding claims,

• wherein the upper component of the module (2) has a rewiring layer (7) on its upper side (18) directed away from the lower component of the module (1) has metallization that forms both an antenna structure as well as passive elements that are connected with the second structural element.

The process in accordance with the previous claim, wherein the lower and the upper wafer or the lower and the upper panel can be connected in particular by means of eutectic bonding, an electrically conductive adhesive, sintering, or soldering.

The process in accordance with the previous claim, wherein, after fastening the lower wafer or the lower panel to the upper wafer or the upper panel, the upper wafer or the upper panel is subjected to a grinding process in which the thickness of the upper wafer or the upper panel is reduced.