Tunable differential via circuit
AssigneeFinisar Corporation
InventorsSteven C. Bird, Ron Greenlaw, Henry Meyer Daghighian
Life of this patent
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Abstract
A circuit of tunable differential vias may include a first tunable via circuit configured to couple a first signal of a differential signal pair from a first outer surface of a printed circuit board (PCB) to a second outer surface of the PCB. The circuit may further include a second tunable via circuit configured to couple a second signal of the differential signal pair from the first outer surface of the PCB to the second outer surface of the PCB. The first tunable via circuit may further include a first buried via spatially offset from the second tunable via circuit to cause a predetermined impedance for the first and second signals through the first and second tunable via circuits at an operating frequency.
Claims20
A circuit, comprising:
- a first tunable via circuit configured to couple a first signal of a differential signal pair from a first outer surface of a printed circuit board (PCB) to a second outer surface of the PCB;
- and
- a second tunable via circuit configured to couple a second signal of the differential signal pair from the first outer surface of the PCB to the second outer surface of the PCB,
- the first tunable via circuit including a first buried via spatially offset from the second tunable via circuit to cause a predetermined impedance for the first and second signals through the first and second tunable via circuits at an operating frequency.
A circuit, comprising:
- a multilayer rigid flex PCB including a first cap layer forming a first outer surface of the multilayer rigid flex PCB and a second cap layer forming a second outer surface of the multilayer rigid flex PCB;
- and
- tunable differential vias formed between the first and second outer surfaces of the multilayer rigid flex circuit, the tunable differential vias including:
- a first tunable via circuit configured to couple a first signal of a differential signal pair from the first outer surface of the multilayer rigid flex PCB to a second outer surface of the multilayer rigid flex PCB;
- and
- a second tunable via circuit configured to couple a second signal of the differential signal pair from the first outer surface of the multilayer rigid flex PCB to the second outer surface of the multilayer rigid flex PCB,
- the first tunable via circuit including a first buried via spatially offset from the second tunable via circuit to cause a predetermined impedance for the first and second signals through the first and second tunable via circuits at an operating frequency.
An optoelectronic module, comprising:
- an optical transmitter;
- an optical receiver;
- a circuit including:
- a printed circuit board (PCB) including:
- a first tunable via circuit configured to couple a first signal of a differential signal pair from a first outer surface of the PCB to a second outer surface of the PCB;
- and
- a second tunable via circuit configured to couple a second signal of the differential signal pair from the first outer surface of the PCB to the second outer surface of the PCB,
- the first tunable via circuit including a first buried via spatially offset from the second tunable via circuit to cause a predetermined impedance for the first and second signals through the first and second tunable via circuits at an operating frequency.
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Dependencies are inferred from the claim text.