Via sizing for ir drop reduction

A computer-readable medium storing instructions that, when executed by a computer, cause the computer to perform a method comprising:

• receiving a first design of an integrated circuit device by receiving locations of a first conductive contact portion in a first layer of conductive contacts and a second conductive contact portion in a second layer of conductive contacts, a location and first size of a first via for electrically interconnecting the first and second contact portions, and a selection and location of a functional group of integrated circuit components;
• modifying the first design of the integrated circuit by substituting the first via with a modified via of a second via or a plurality of vias, according to a predetermined criterion;
• and
• confirming that the modified design complies with a predetermined set of design rules.

An integrated circuit device, comprising:

• a first layer comprising a first plurality of conductive portions adapted to be connected to a common voltage source;
• a second layer comprising a second plurality of conductive portions;
• an insulating layer interposed between the first and second layers,
• the first plurality of conductive portions overlapping the second plurality of conductive portions across a plurality of regions of the insulating layer;
• and
• a plurality of vias each interconnecting a respective pair of the mutually overlapping portions of the conductive portions of the first and second layers through the respective region of the insulating layer, wherein
• a first one of the plurality of regions of the insulating layer contains a first via configuration, a second one of the plurality of regions of the insulating layer contains a second via configuration, the first via configuration having a larger total via cross-sectional area than the second via configuration.