Electronic component and three-terminal capacitor

An electronic component comprising:

• a first wiring substrate including a first ground-side land and a first hot-side land provided on a mounting surface;
• a second wiring substrate on a first surface of which a semiconductor chip is mounted, including a first ground-side land and a first hot-side land provided on a second surface on an opposite side, and mounted on the first wiring substrate such that the second surface faces the mounting surface of the first wiring substrate;
• and
• a three-terminal capacitor between the first wiring substrate and the second wiring substrate and including a first ground-side outer electrode, a second ground-side outer electrode, a first hot-side outer electrode, and a second hot-side outer electrode;
• wherein
• the first ground-side land of the first wiring substrate and the first ground-side outer electrode of the three-terminal capacitor are connected to each other with a first solder bump interposed between the first ground-side land of the first wiring substrate and the first ground-side outer electrode of the three-terminal capacitor;
• the first hot-side land of the first wiring substrate and the first hot-side outer electrode of the three-terminal capacitor are connected to each other with a second solder bump interposed between the first hot-side land of the first wiring substrate and the first hot-side outer electrode of the three-terminal capacitor;
• the first ground-side land of the second wiring substrate and the second ground-side outer electrode of the three-terminal capacitor are connected to each other with a third solder bump interposed between the first ground-side land of the second wiring substrate and the second ground-side outer electrode of the three-terminal capacitor;
• and
• the first hot-side land of the second wiring substrate and the second hot-side outer electrode of the three-terminal capacitor are connected to each other with a solder bump interposed between the first hot-side land of the second wiring substrate and the second hot-side outer electrode of the three-terminal capacitor.