Back to results
US 2019/0164879 A1Published application
Wiring substrate and semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorYoshihisa Kanbe
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes a wiring, a solder resist layer formed on the wiring and having an opening from which a part of the wiring is exposed, a copper seed layer formed in the opening, a copper layer formed on the seed layer and filling the opening up to a certain depth thereof, and a metal post erected on the copper layer, having an upper surface located at a position higher than an upper surface of the solder resist layer and including any one of nickel, silver and tin.
Claims4
A wiring substrate comprising:
- a wiring;
- a solder resist layer formed on the wiring and having an opening from which a part of the wiring is exposed;
- a copper seed layer formed in the opening;
- a copper layer formed on the seed layer and filling the opening up to a certain depth thereof;
- and
- a metal post erected on the copper layer, having an upper surface located at a position higher than an upper surface of the solder resist layer and including any one of nickel, silver and tin.
3 more elements
A semiconductor device comprising:
- a wiring;
- a solder resist layer formed on the wiring and having an opening from which a part of the wiring is exposed
- a copper seed layer formed in the opening;
- a copper layer formed on the seed layer and filling the opening up to a certain depth thereof;
- a metal post erected on the copper layer, having an upper surface located at a position higher than an upper surface of the solder resist layer and including any one of nickel, silver and tin;
- and
- a semiconductor element connected to the upper surface of the metal post.
4 more elements
Dependencies are inferred from the claim text.