Premolded substrate for mounting a semiconductor die and a method of fabrication thereof
AssigneeAsm Technology Singapore Pte Ltd
InventorChun Ho FAN
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Abstract
A method of forming a premolded substrate for mounting a semiconductor die, comprising the steps of providing a carrier; forming conductive circuits on the carrier and forming a plurality of metallic contacts on the conductive circuits. Thereafter, the method further comprises encapsulating the carrier by compressing a top portion of each metallic contact to crush and flatten the top portion of each metallic contact, and introducing a molding compound to surround the plurality of metallic contacts such that the flattened top surfaces of the plurality of metallic contacts are exposed on and flush with a top surface of the molding compound.
Claims16
A method of forming a premolded substrate for mounting a semiconductor die, the method comprising:
- providing a carrier;
- forming conductive circuits on the carrier;
- forming a plurality of metallic contacts on the conductive circuits;
- and thereafter,
- encapsulating the carrier by compressing a top portion of each metallic contact to crush and flatten the top portion of each metallic contact, and introducing a molding compound to surround the plurality of metallic contacts such that the flattened top surfaces of the plurality of metallic contacts are exposed on and flush with a top surface of the molding compound.
A premolded substrate for mounting a semiconductor die, the premolded substrate comprising:
- conductive circuits;
- a plurality of metallic contacts on the conductive circuits;
- and
- a molding compound surrounding the plurality of metallic contacts and exposing a top surface of the metallic contacts;
- wherein the top surfaces of the plurality of metallic contacts have been crushed and flattened to be flush with a top surface of the molding compound.
Dependencies are inferred from the claim text.