Chip-on-film semiconductor device
AssigneeSharp Kabushiki Kaisha
InventorNOBUAKI ASAYAMA
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Abstract
A chip-on-film semiconductor device includes a translucent insulator film, a first wire group including a plurality of wires on a first surface of the insulator film, a second wire group including a plurality of opaque wires on a second surface of the insulator film opposite to the first surface, and a semiconductor chip mounted on the first surface. The wires of the first wire group and semiconductor connection terminals of the semiconductor chip are joined together at junction portions. The second surface includes an unwired region, in which none of the wires of the second wire group are disposed, at a portion corresponding to any of the junction portions.
Claims6
A chip-on-film semiconductor device, comprising:
- a translucent insulator film;
- a first wire group including a plurality of wires on a first surface of the insulator film;
- a second wire group including a plurality of opaque wires on a second surface of the insulator film opposite to the first surface;
- and
- a semiconductor chip mounted on the first surface,
- wherein the wires of the first wire group and semiconductor connection terminals of the semiconductor chip are joined together at junction portions, and
- wherein the second surface includes at least one unwired region, in which none of the wires of the second wire group are disposed, at at least one portion corresponding to at least one of the junction portions.
Dependencies are inferred from the claim text.