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US 2019/0164871 A1Published application
Semiconductor package structure having a heat dissipation structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChih Cheng LEE, Yu-Lin Shih
Life of this patent
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Abstract
A semiconductor substrate includes a dielectric layer, a heat dissipation structure and a first patterned conductive layer. The dielectric layer has a surface. The heat dissipation structure is surrounded by the dielectric layer. The heat dissipation structure defines a space and includes a liquid in the space. The first patterned conductive layer is disposed adjacent to the surface of the dielectric layer and thermally connected with the heat dissipation structure.
Claims24
A semiconductor substrate, comprising:
- a dielectric layer having a surface;
- a heat dissipation structure surrounded by the dielectric layer, the heat dissipation structure defining a space and including a liquid in the space;
- and
- a first patterned conductive layer disposed adjacent to the surface of the dielectric layer and thermally connected with the heat dissipation structure.
1 more element
A semiconductor package structure, comprising:
- a first substrate, comprising:
- a dielectric layer having a surface;
- a heat dissipation structure surrounded by the dielectric layer, the heat dissipation structure defining a space and including a liquid in the space;
- and
- a first patterned conductive layer disposed adjacent to the surface of the dielectric layer and thermally connected with the heat dissipation structure;
- and
- a chip disposed on the first substrate and electrically and thermally connected to the first patterned conductive layer.
4 more elements
24-34. (canceled)
Dependencies are inferred from the claim text.