Semiconductor package structure and semiconductor module including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoungJoon Lee, Sunwon Kang
Life of this patent
Estimating the term…
Abstract
Disclosed are semiconductor package structure and semiconductor modules including the same. The semiconductor module includes a circuit board, a first semiconductor package over the circuit board, and a connection structure on the circuit board and connecting the circuit board and the first semiconductor package. The first semiconductor package includes a first package substrate. A difference in coefficient of thermal expansion between the connection structure and the circuit board may be less than a difference in coefficient of thermal expansion between the circuit board and the first package substrate.
Claims20
A semiconductor module, comprising:
- a circuit board;
- a first semiconductor package over the circuit board;
- and
- a connection structure on the circuit board and connecting the circuit board and the first semiconductor package,
- wherein the first semiconductor package includes a first package substrate, and
- wherein a difference between thermal expansion coefficients of the connection structure and the circuit board is less than a difference between thermal expansion coefficients of the circuit board and the first package substrate.
A semiconductor package structure, comprising:
- a connection structure including a plurality of outer leads and a plurality of inner leads between the outer leads;
- and
- a semiconductor package on the connection structure and including:
- a package substrate,
- a plurality of solder balls on a first side of the package substrate, and
- a semiconductor chip on a second side of the package substrate, opposite the first side,
- wherein the inner leads are in contact with corresponding solder balls.
A semiconductor module, comprising:
- a circuit board;
- and
- a semiconductor package structure on the circuit board,
- wherein the semiconductor package structure includes:
- a connection structure including a plurality of outer leads and a plurality of inner leads between the outer leads;
- and
- a semiconductor package on the connection structure and including
- a package substrate,
- a plurality of solder balls on a first side of the package substrate, and
- a semiconductor chip on a second side, opposite the first side, of the package substrate,
- wherein the inner leads are in contact with the solder balls, and
- wherein the outer leads are in contact with the circuit board.
Dependencies are inferred from the claim text.