Multipart lid for a semiconductor package with multiple components

A structure comprising:

• a substrate;
• a first integrated component electrically connected and mounted on the substrate;
• one or more discrete components electrically connected and mounted on the substrate;
• and
• a substrate mounted multipart lid covering both the first integrated component and the one or more discrete components, wherein the multipart lid comprises an upper part and a lower part, wherein a coefficient of thermal expansion (CTE) of the lower part substantially matches an average of the CTE of the first integrated component and the CTE of the substrate, wherein the CTE of the first integrated circuit is 3 ppm/° C., and the CTE of the substrate is 25 ppm/° C.,
• wherein the multipart lid comprises a coplanar bottom surface, wherein the coplanar bottom surface comprises a first cavity corresponding to the first integrated circuit, and one or more second cavities, each of the one or more second cavities corresponding to one of the one or more discrete components,
• wherein each part of the two or more parts comprises a CTE matching a CTE of a corresponding component of the one or more discrete components.

A method of fabricating a multipart lid, the method comprising:

• forming an upper part, wherein the upper part comprises heat transfer capabilities, the upper part comprises a cube shape and a first cavity on a bottom surface, wherein the first cavity extends partially into the upper part;
• forming a lower part, wherein the lower part comprises a coefficient of thermal expansion (CTE) substantially matching a CTE of a first integrated component, wherein the CTE of the first integrated circuit is 3 ppm/° C., the lower part comprises a coplanar bottom surface, a second cavity corresponding to the first cavity, the lower part comprises a third cavity, wherein the combined first cavity and the second cavity correspond to a shape of a discrete component, wherein the third cavity corresponds to a shape of the integrated circuit;
• and
• joining the upper part and the lower part, aligning the first cavity and the second cavity.