Fan-out semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJung Hyun CHO, Young Sik HUR, Yong Ho BAEK
Life of this patent
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Abstract
A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole and including an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, a second connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the semiconductor chip, and an encapsulant encapsulating the semiconductor chip and having a cavity disposed above the inactive surface of the semiconductor chip.
Claims20
A fan-out semiconductor package comprising:
- a first connection member having a through-hole;
- a first semiconductor chip disposed in the through-hole and including an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
- a second connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the first semiconductor chip;
- and
- an encapsulant encapsulating the first semiconductor chip and having a cavity disposed above the inactive surface of the semiconductor chip.
A fan-out semiconductor package comprising:
- a first connection member having a through-hole;
- a semiconductor chip disposed in the through-hole and including an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
- a second connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the semiconductor chip;
- an adhesive layer disposed on the inactive surface of the semiconductor chip;
- and
- an encapsulant encapsulating side surfaces of the first semiconductor chip and having an upper surface having a step with respect to the adhesive layer.
Dependencies are inferred from the claim text.